Continuous Improvement Program
A continuous improvement program (CIP) leverages unpatterned wafer defect inspection to identify the specific process tools causing defects. With a tool monitoring CIP in place, automotive fabs can set objective targets for reducing the process defects that affect reliability.
Drive to Zero Defect
With Zero Defect Screening, fabs monitor 100% of die on all wafers at the critical process steps. This requires an inspector that is fast, sensitive and can reliably identify which defects matter. With this method, die that may fail are removed from the supply chain at the fab, where cost is lowest. A high sensitivity inspection strategy can partner with screening techniques to enable discovery of yield-critical defects for faster characterization of new processes and additional defect reduction.
Advanced Design Node Inflection
Automotive features such as machine vision and AI require advanced ICs. To attain higher yield and quality standards for advanced design node devices, fabs require discovery of all systematic defect sources and an “every defect matters” approach to improving baseline yield.
Enhanced IC Packaging and PCBs
Today’s advanced packaging technology relies on innovative process techniques to provide improved IC component performance and multi-function integration. To prevent defective devices from moving forward in the supply chain, screening and sorting are important quality control steps for packaged IC components, IC substrates and printed circuit boards (PCBs). Inspection and metrology systems capture critical defects and variations for the continuous improvement of packaging and PCB processes, reliability-related issues and device failure traceability.
Power Device Reliability
Implemented in a wide range of automotive subsystems, power devices require the same quality standards as other automotive ICs. Specialized equipment for SiC epitaxy and GaN-on-silicon processes, and inspection systems for SiC substrates help manufacturers of power devices achieve automotive defect standards.
Specialty Semiconductor Etch Processes
I-PAT®
I-PAT (Inline Defect Part Average Testing) is a new method that allows automobile manufacturers to reduce the incidence of latent reliability defects in semiconductor electronic components, recognize at-risk die for exclusion from the supply chain and reduce the incidence of escapes of die that will fail prematurely from the fab. (I-PAT patent pending)
![Black and blue printed circuit board with car icon on the processor](png/i-pat.png)
Automotive Highlights
Insights from our Innovators: Dr. Chet Lenox Discusses an Automotive Industry Shifting Gears
Apr 18, 2023
The global automotive industry is in the early stages of a revolutionary shift away from internal combustion engines and an...
How Process Technology for Automotive MEMS Jump Started a Whole Industry
Jul 22, 2021
Micro Electromechanical Systems (MEMS), for anyone that is not familiar with the term, are micromachines which convert movement into an electrical signal, or...
New Automotive Solutions Ensure High Quality, High Reliability, High Yield
Jun 22, 2021
KLA is committed to helping the automotive industry achieve strict electronics quality standards. To this end, we’ve unveiled four new...
Electronics Innovation in the Automotive Industry
Jun 21, 2021
Peruse the following infographic to see how semiconductor innovations are advancing today’s automobiles. When you’re done, browse our Automotive Solutions...
Automotive: Innovations, Trends and the Intersection with Semiconductors
Jun 15, 2021
The semiconductor industry performed better than expected in 2020 despite the impact of COVID-19 on the global economy...
KLA Talks Automotive Semiconductors at #SPIElitho
Feb 19, 2021
KLA is a longtime participant and sponsor of the upcoming SPIE Advanced Lithography Digital Forum held on February 22-26, 2021....
Explore More Solutions
Artificial Intelligence
AI helps make sense of big data! Our solutions use AI to accelerate production of the very ICs that will power the next generation of AI innovation.
IoT
The Internet of Things is expanding quickly, and the demand for smart devices is growing with it! Our solutions drive increasing production to match it.
5G Technology
5G is bringing higher data speeds and lower latency to the next generation of devices! Our solutions help ensure the necessary yield and reliability.
Automotive Papers and Commentary
Semiconductor Engineering / Feb 2021
Part Average Tests for Auto ICs Not Good Enough
Semiconductor Engineering / Feb 2021
Automotive Test Moves In-System
Semiconductor Engineering / Feb 2021
Why Improving Auto Chip Reliability Is So Hard
Semiconductor Engineering / Nov 2020
Chips Good Enough to Bet Your Life On
Autonomous Vehicle Technology / Sep 2019
Semiconductors Shift to Ensure Greater Auto Reliability
Semiconductor Engineering / May 2019
Gaps Emerge in Automotive Test
Automotive Electronics Council Reliability Workshop / Apr 2019
Toward Zero Defect: Automotive Fab Best Practices for Assessing “Best Performing Tools”
Automotive Electronics Council Reliability Workshop / Apr 2019
Practical Applications of “Measurement Systems Analysis” (MSA) for Semiconductor Process Control
Semiconductor Engineering / Apr 2019
Electric Cars Gain Traction, But Challenges Remain
ECN / Feb 2019
Reliability in Autonomous Driving Systems Starts with Pursuit of Zero Defects
Semiconductor Engineering / Feb 2019
Reliability Becomes The Top Concern In Automotive
Semiconductor Engineering / Jan 2019
Chasing Reliability In Automotive Electronics
Elektronik Automotive / Dec 2018
Zuverlässiger Einsatz von Halbleitern im Kraftfahrzeug
Solid State Technology / Nov 2018
Process Watch: Monitoring for Excursions in Automotive Fabs
Solid State Technology / Aug 2018
Process Watch: Automotive Defect Sensitivity Requirements
Chip Scale Review / Aug 2018
Automotive Apps Are Driving Inspection Requirements for Advanced Nodes
Automotive Electronics Council Reliability Workshop / Apr 2018
Inline Defect Part Average Testing (I-PAT)
Automotive Electronics Council Reliability Workshop / Apr 2018
Latent Reliability Defects in Automotive Chip Packages
Solid State Technology / Mar 2018
Process Watch: Baseline Yield Predicts Baseline Reliability
Semiconductor Engineering / Mar 2018
Finding Faulty Auto Chips
Semiconductor Engineering / Jan 2018
Automotive IC Industry Trends
Solid State Technology / Jan 2018
Process Watch: The (Automotive) Problem With Semiconductors
Semiconductor Engineering / Oct 2017
Radar Versus LiDAR
Evaluation Engineering / Oct 2017
Autonomous Vehicles, New Tech Drive Automotive Test Market
Semiconductor Engineering / Sep 2017
Foundries Accelerate Auto Efforts