Talking Poster (with captions) – Introduction to physical vapor deposition (PVD) of metal layers for power devices. The processes include thick Al deposition to the frontside of the wafer where SPTS’s Sigma^® fxP system can deposit thick films with a high deposition rate to increase productivity, but without the film defects normally associated with high rate deposition. For depositing metals on the back side of the power device wafer, a stack of different metals are required. For back side metal deposition, effective low damage pre-clean and stress control are paramount.