Introducing the new Orbotech Corus™ 8M double-sided direct imaging (DI) solution, the first system built on the all-in-one revolutionary Orbotech Corus platform, combining the functionality and automation of an entire direct imaging production line in a closed, clean and compact unit.  Providing increased resolution with high accuracy to pattern finer lines, the extendable and efficient Orbotech Corus DI platform will support continued innovation for advanced high-density interconnect PCBs and IC substrates.