Today’s chip manufacturers contend with strict requirements when it comes to quality assurance. KLA’s new ICOS™ F260 system provides all-side inspection and die sorting for diced wafer-level packages and bare die with industry-leading accuracy and high-speed throughput. Check out the video and learn how the ICOS F260 offers the fully automated ability to detect both internal and superficial chip defects with extremely low overkill and underkill rates to help optimize yield and remove defective chips before being assembled into end products.